Facilities

Growth and Fabrication:
  1. Magnetron Sputtering System
2. Dry transfer system for 2D materials
3. Atomic layer deposition (ALD)
4. Metal processing chamber
5. Organic processing chamber
6. Glove box system
7. Plasma asher system
8. Photo-lithography yellow room
9. Mask aligner (UCRF)
10 Dielectric RIE (UCRF)
11. E-beam lithography (UCRF)

Characterization:
  1. Physical properties measurement system
2. Magnetic properties measurement system
3. Hall measurement system
4. Closed-cycle cryostat
5. Probe station
6. Mini-SEM
7. Mini-XRD
8. Optical microscope



Growth and Fabrication:

1. Magnetron Sputtering System


Specification:
1. Chamber : Main (< 5 x10^-9 Torr, up to 800 ºC, 6 gun ports), Loadlock (< 1 x10^-8 Torr)
2. Automatic pressure control unit
3. DC Power supply : Max 1000 W, CW CV CC control

Manual:




2. Dry transfer system for 2D materials


Specification:
1. Optical microscope (Nikon) : DS-Ri2 (Camera), Objective lens (5x, 10x, 20x, 50x, 100x), LED Lamphouse
2. XYZ stage : 8-axis manual & motorized linear stage, motorized linear stage
   (resolution : 0.05 µm, range : 25 mm, 3-axis), heat up to 200 ºC
3. Active Vibration Isolation System (DVIA-T67, DAEIL SYSTEMS)
4. Conditions : O2, H2O < 1 ppm in Ar-filled glove box

Manual:




3. Atomic layer deposition


Atomic layer deposition: Tutorial, Animation

Specification:
1. Chamber: colsed coupled sample heater up to 500 C, QCM monitor
2. Gas delivery line: 2 carrier gas lines, 3. Precusor cells(2 with temperature control), plasma source line
4. Software control: Robo ALD process control

Manual:




4. Metal processing chamber


Specification:
2 thermal sources, 1 e-beam source (6kW, 7cc multi pocket), LN2 trap for substrate holder

Manual:



5. Organic processing chamber


Specification:
3 temperature controllable organic source, 1 thermal sources, LN2 trap for substrate holder

Manual:



6. Glove box system


Specification:
1. Organic process chamber unit Features: 3 temperature controllable organic source, 1 metal sources, LN2 trap for substrate holder
2. Metal process chamber unit Features: 2 metal sources, 1 e-beam source (6kW, 7cc multi pocket)
3. 2 Glove box units with T-antichamber connection

Manual:



7. Plasma asher system


Specification:
1. Microwave power (2.45GHz, 50W/m2)
2. Gas: O2, Ar
3. Stage: 8 inch size




7. Photo-lithography yellow room


Specification:

Manual:



8. Mask aligner (UCRF)


Specification:
1. Up to 6inch
2. UV lamp : Hg 350W
3. Wavelength : 350 ~ 450nm(I, H, G-line)
4. Lamp uniformity : ≤ 3%
3. Dual microscope(90X ~ 500X)

Manual:



9. Dielectric RIE (UCRF)


Specification:
1. Etch Rate: 1000 - 3000 Å/min
2. Selectivity: ≤ 2±0.5:1 SiN:PR
3. Uniformity: ≤ ±3.0 %
4. RF Power: 600W
5. Selectivity:SiO2:Resist = 3~5 : 1 (Resist dependent)

Manual:



10. E-beam lothography (UCRF)


Specification:
1.Theoretical beam size : 2.1 nm for 100 keV, 7 nA
2. Line width : ≤ 5 nm
3. Deflection : vector scan, 55 MHz
4. Address grid resolution : 1 nm, 1 mm main field
5. Beam voltage : 30 ~ 100 keV
6. Writing area : 195 mm x 195 mm
7. Substrate size : 5 ~ 200 mm
8. Automation : 10 chucks automatic loading
9. Repeatable : 20 nm over wafer

Manual:







Characterization:

1. Physical properties measurement system (PPMS)


Specification:
1. Temperature Range : 1.9 K - 400 K
- Cryogen-free cooling technology.
- Continuous low-temperature control
- Controlled temperature sweep mode)
- Temperature accuracy : ±0.5 %
- Temperature stability : 0.2 % for T ≤10 K, 0.02 % for T > 10K

2. Magnet & Uniformity
- Magnet range : ±9 T (90,000 Gauss)
- Field resolution : 0.3 Oe to 1 T: 3 Oe to 9 T
- Slew Rate : Up to 200 Oe/sec

3. Elecrical Transport Option (ETO)
- Current Source Specifications: Current Range (10 nA to 100 mA), Frequency Range (DC, and 0.1Hz to 200 Hz AC)
- Resistance Specifications: Absolute Accuracy (0.1% for R < 200 kOhms), Relative Sensitivity (±10 nOhms RMS)
- Resistivity Range: 4uOhms to ~10 MOhms in 4-wire mode, 1 MOhms to ~5 GOhms in 2-wire mode (typical)

4. Vibrating Sample Magnetometer
- Geometry: Magnetic field II vibration and first order gradiometer coils, Coil-set bore (6.3 mm)
- Sample holders provided:
Tube (inner diameter = 3.2 mm; outer diameter = 4.8 mm)
Paddle (diameter = 3.2 mm), coil-set baseline (9 mm)
- VSM measurement parameters:
VSM oscillation frequency (calibrate): 40 Hz
VSM oscillation amplitude(typical): range of 0.5 mm - 10 mm peak-peak (typically 4 mm peak-peak)
- Sensitivity using the above typical parameters
Sensitivity : 2X10-6 emu/tesla with 1sec. averaging (typical)
Largest measurable moment : ∼150 emu (40 Hz, 1 mm p-p)
- VSM oven upto 1000 K

5. Thermal Transport System
- Thermal Conductivity κ
- Seebeck coefficient S
- Thermoelectric figure of merit ZT

6. Heat Capacity
- Temperature Range : 1.9 K - 400 K
- Sample Size: 1 - 500 mg(20 mg, typ.)
- Heat Capacity Resolution: 10 nJ/K at 2 K
- Measurement Accuracy: < 5%, 2 - 300 K < 2%, typ.

7. External electronics
- Keithley 2636 Duel channel sourcemeter
- Keithley 2400 Sourcemeter
- Keithley 2182A Nanovoltmeter
- Keithley 6221 AC/DC current source
- EG&G 5209 Lock-in amplifier
- SR310 High voltage

Manual:



2. Magnetic properties measurement system (MPMS)


Specification:
1. Temperature Range : 1.9 K - 400 K
- Cryogen-free cooling technology.
- Continuous low-temperature control
- Controlled temperature sweep mode)
- Temperature accuracy : ±0.5 %
- Temperature stability : 0.2 % for T ≤10 K, 0.02 % for T > 10K

2. Magnet & Uniformity
- Magnet range : ±9 T (90,000 Gauss)
- Field resolution : 0.3 Oe to 1 T: 3 Oe to 9 T
- Slew Rate : Up to 200 Oe/sec

Manual:



3. Closed cycle cryostat (to be updated)


Specification:

Manual:



4. Probe station


Specification:

Manual:


5. Optical Microscope


Specification:

Manual: